Capacity Building for Resilient Microelectronics for Extreme Environments (XTREME)

The XTREME program is a four-year, $6 million NSF-funded initiative focused on strengthening research capacity in resilient microelectronics designed to operate in extreme environments. Led by David Estrada with an interdisciplinary team at Boise State University, the project brings together expertise across engineering and related fields to advance microelectronics research, build institutional research capacity, and support the development of a skilled workforce in this rapidly growing area.

NSF Award #2546677

Principal Investigator: David Estrada

Co-PIs: Indrajit Charit, Krishna Pakala, John Russell, Brian J. Jaques

Award: $6,000,000

Period: August 1, 2026–July 31, 2030

Program: EPSCoR RII: E-RISE